Issue 1, 2023

Bonding and the role of electrostatics in driving C–C bond formation in high valent organocopper compounds

Abstract

The electronic structures and contrasting reactivity of [Cu(CF3)4] and [Cu(CF3)3(CH3)] were probed using coupled cluster and ab initio valence bond calculations. The Cu–C bonds in these complexes were found to be charge shift bonds. A key finding is that electrostatics likely prevent [Cu(CF3)4] from accessing a productive transition state for C–C bond formation while promote one for [Cu(CF3)3(CH3)]. These results therefore highlight essential design criteria for Cu-mediated C–C/C–heteroatom bond formation.

Graphical abstract: Bonding and the role of electrostatics in driving C–C bond formation in high valent organocopper compounds

Supplementary files

Article information

Article type
Communication
Submitted
28 Oct 2022
Accepted
22 Nov 2022
First published
29 Nov 2022

Chem. Commun., 2023,59, 98-101

Author version available

Bonding and the role of electrostatics in driving C–C bond formation in high valent organocopper compounds

J. Shearer, D. Vasiliauskas and K. M. Lancaster, Chem. Commun., 2023, 59, 98 DOI: 10.1039/D2CC05865K

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