Issue 22, 2023

Photo-chemically assisted redox-nano welding for highly conductive and robust copper-based electrodes

Abstract

In this study, high-quality conductive electrodes were fabricated by improving the sintering efficiency and packing density of Cu sub-microparticle (sub-μP) electrodes through IPL sintering with redox reaction-induced nano-welding. This process includes both pre-oxidation and photothermal chemical reduction. The pre-oxidation in the Cu sub-μP electrodes can easily be triggered (within a few seconds) via a hot air treatment (500 °C). The oxidized Cu sub-μP electrodes are reduced and sintered simultaneously through a photothermal chemical reaction during the IPL sintering process. Cu nanoparticles, which are newly formed in the photothermal chemical reduction process, play an important role as interconnection materials between Cu sub-μPs during the IPL sintering process. The effect of exposure time and temperature in the hot air treatment on the oxidation properties of Cu sub-μPs are investigated systematically using noncontact spectroscopic temperature-sensing techniques and X-ray diffraction analysis. After IPL sintering, the conductive Cu sub-μP electrodes showed highly sintered morphologies, which resulted in extremely low electric resistivity (8.34 μΩ cm) under optimal conditions.

Graphical abstract: Photo-chemically assisted redox-nano welding for highly conductive and robust copper-based electrodes

Supplementary files

Article information

Article type
Paper
Submitted
07 Mar 2023
Accepted
07 May 2023
First published
19 May 2023

J. Mater. Chem. C, 2023,11, 7383-7388

Photo-chemically assisted redox-nano welding for highly conductive and robust copper-based electrodes

J. Lee, S. M. Lee, J. H. Kwak, J. Kim, S. J. Kim, K. Hong, K. S. Yoo, I. H.-S Yang and H. J. Jeong, J. Mater. Chem. C, 2023, 11, 7383 DOI: 10.1039/D3TC00828B

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