Issue 3, 2024

Comparison of electron scattering by acoustic-phonons in two types of quantum wells with GaAs and GaN materials

Abstract

In this work, we report a detailed comparison of electron–acoustic-phonon (EAP) interaction strength in symmetric (parabolic) and asymmetric (semi-parabolic) quantum-wells (QWs) for both GaAs and GaN materials. The operator projection method will be utilized to calculate the acoustic-phonon-assisted cyclotron resonance (CR) absorption power. The EAP interaction strength is determined by measuring the full width at half maximum (FWHM) of the acoustic-phonon-assisted CR absorption peak based on the profile of the curve describing the dependence of the acoustic-phonon-assisted CR absorption power on the photon energy. The studied result reveals that the EAP interaction strengths in the symmetric and asymmetric QWs are functions of the electron temperature (ET), external magnetic field (EMF), and confined potential frequency (CPF). Namely, the larger the ET, the EMF, and the CPF, the stronger the EAP interaction strengths in the symmetric and asymmetric QWs are for both GaN and GaAs materials. More importantly, the obtained result demonstrates that under the influence of the structural (CPF) and external (ET and EMF) parameters, the EAP interaction strength in the symmetric QW is always much stronger than that in the asymmetric QW for both GaN and GaAs materials. Simultaneously, the EAP interaction strength in the GaN material is much stronger than that in the GaAs material for both the symmetric and asymmetric QWs.

Graphical abstract: Comparison of electron scattering by acoustic-phonons in two types of quantum wells with GaAs and GaN materials

Article information

Article type
Paper
Submitted
25 Apr 2023
Accepted
16 Oct 2023
First published
16 Nov 2023
This article is Open Access
Creative Commons BY-NC license

Nanoscale Adv., 2024,6, 832-845

Comparison of electron scattering by acoustic-phonons in two types of quantum wells with GaAs and GaN materials

T. C. Phong, L. N. Minh and N. D. Hien, Nanoscale Adv., 2024, 6, 832 DOI: 10.1039/D3NA00274H

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