Issue 42, 2024

Direct patterning of liquid materials on flat and curved substrates using flexible molds with through-hole and post arrays

Abstract

Liquids undergo continuous deformation in the presence of external shear stresses; however, they are pinned between structures owing to their viscosity. Therefore, reshaping the liquids using their intrinsic material properties and structural interfaces is possible. In this study, we used the template-guided forming (TGF) method to reshape and produce oil patterns on flat and curved substrates. To produce oil patterns, we developed two oil patterning methods: direct heating-based oil patterning (DHOP) and solvent evaporation-based oil patterning (SEOP), which were characterized using various oils and solvents. To overcome the limitation of relying solely on liquid patterning that undergoes complete evaporation, we successfully fabricated liquid films using oil and nonpolar organic solvents that exhibit long-term stability. Therefore, achieving durability and control over the film thickness using nonpolar organic solvents has great potential for future applications in microfluidics. Furthermore, we demonstrated that the SEOP method in conjunction with TGF can produce various and unconventional patterns of an organic photoresist (SU-8), which cannot be produced through standard photolithography. Hence, we conclude that the proposed TFG-based oil pattering methods could be highly useful for producing unconventional and unprecedented patterns on flat and curved substrates for various applications, including microelectronics, optics, filtration and separation, biomedical engineering, and nanotechnology.

Graphical abstract: Direct patterning of liquid materials on flat and curved substrates using flexible molds with through-hole and post arrays

Supplementary files

Article information

Article type
Paper
Submitted
19 Jul 2024
Accepted
25 Sep 2024
First published
01 Oct 2024
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2024,14, 31217-31226

Direct patterning of liquid materials on flat and curved substrates using flexible molds with through-hole and post arrays

Y. Chae, J. Bae and T. Kim, RSC Adv., 2024, 14, 31217 DOI: 10.1039/D4RA05252H

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