Debondable phenoxy-based structural adhesives with β-amino amide containing reversible crosslinkers

Abstract

This study introduces dynamic phenoxy-based adhesives using β-aminoamide exchange chemistry, designed for durability, reprocessability and sustainability. Synthesized through a two-step process, the adhesive features linear poly-aminoamides and tailored amine formulations to optimize adhesion, flexibility, and the glass transition. The corresponding phenoxy-based adhesives demonstrated effective crosslinking, high thermal stability (Td5% ~340-350 °C), and temperature-responsive viscoelastic properties. Notably, the materials with 5% mol of TETA (E-BAAT5) exhibited ideal activation energy for stress relaxation, exceptional creep resistance, and retained up to 98% lap shear strength after recycling, with controlled debonding at elevated temperatures, making it ideal for high-performance, recyclable adhesive applications.