One-dimensional Cu–Ni core–shell composites as liquid epoxy molding compound fillers for enhanced heat dissipation and electromagnetic interference shielding in high-bandwidth memory

Abstract

Driven by the rapid advancement of artificial intelligence (AI) technologies, high-bandwidth memory (HBM) has emerged as a technological breakthrough, taking advantage of its exceptional data transfer speed and high bandwidth using through-silicon vias (TSVs). However, the compact design and rapid operation of HBM result in elevated electromagnetic interference (EMI) and heat generation, both of which contribute to rapid performance degradation. Herein, we effectively manage EMI and heat generation issues of HBM by incorporating one-dimensional (1D) Cu–Ni composites into liquid-type epoxy molding compounds (LMC) as multifunctional fillers. As representative 1D Cu–Ni composites, we designed core–shell structured Cu–Ni nanowires and nano-necklaces (CS-CNNW and CS-CNNK, respectively), and their EMI shielding as well as heat dissipation capabilities are systematically evaluated. Benefiting from synergistic merits of elemental Cu and Ni, CS-CNNW and CS-CNNK provide high thermal conductivity and efficient EMI shielding across wide frequency ranges. Moreover, taking advantage of 1D morphologies, CS-CNNW and CS-CNNK can be uniformly dispersed in LMC, achieving enhanced particle-to-particle interconnections even at low practical loading levels. As a result, both CS-CNNW and CS-CNNK exhibit enhanced EMI shielding across broad frequency ranges and accelerated heat dissipation to mitigate thermal bottleneck issues. Finally, by three-dimensional thermal simulations of a practical HBM system, we verify the practical feasibility of CS-CNNW and CS-CNNK as efficient heat sink filler additives for LMC.