A graphene/C-PDA/carbon fiber ternary heterostructure network enables lightweight polyimide composites with enhanced electromagnetic shielding and thermal management capabilities

Abstract

High-performance polymer composites (HFPCs) integrating electromagnetic interference (EMI) shielding and thermal conductivity (TC) are urgently needed for advanced electronics; however, challenges remain in achieving a balanced integration of TC, thermal stability, conductivity, and EMI shielding within a single material. Herein, we guided by interfacial engineering strategies present a polyimide (PI) composite featuring a ternary carbon heterostructure network, achieving an exceptional EMI shielding effectiveness of 95 dB and significantly enhanced TC (3.38 W m−1 K−1, a 1151% improvement over pure PI). The graphene/carbonized polydopamine/carbon fiber (CPPG) ternary carbon heterostructure network was realized via an interfacial engineering strategy (approach combining polydopamine-modulated interface modification and controlled in situ co-carbonization). The enhanced performance stems from the synergistic CPPG network, which facilitates electromagnetic wave (EMW) dissipation through multi-scale polarization loss while establishing continuous phonon transport pathways for efficient heat transfer. The graphene-wrapped fiber ternary heterostructure creates multi-scale heterostructure reflection interfaces, enhancing EMW conduction and polarization losses, while the continuous carbon skeleton ensures unimpeded phonon transport. The resulting PI composites exhibit a lightweight, thermally stable, and highly efficient dual-functional structure, making them promising candidates for next-generation aerospace electronics, integrated circuits, and high-frequency communication devices.

Graphical abstract: A graphene/C-PDA/carbon fiber ternary heterostructure network enables lightweight polyimide composites with enhanced electromagnetic shielding and thermal management capabilities

Supplementary files

Article information

Article type
Paper
Submitted
16 Apr 2025
Accepted
25 May 2025
First published
30 May 2025

J. Mater. Chem. A, 2025, Advance Article

A graphene/C-PDA/carbon fiber ternary heterostructure network enables lightweight polyimide composites with enhanced electromagnetic shielding and thermal management capabilities

X. Li, W. Cao, X. Yang, M. Wang, Y. Chen, T. Xu, Y. Zhang, N. Song, S. Sun and P. Ding, J. Mater. Chem. A, 2025, Advance Article , DOI: 10.1039/D5TA03019F

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