Research on high thermal conductivity PPENK/PVP modified BN electrospinning hot-pressed multifunctional nanocomposite films

Abstract

With the rapid advancements of communication technology, developing multifunctional thermally conductive materials is crucial to addressing future heat management challenges. In this study, highly thermally conductive PPENK/PVP modified BN (PPENK/MBN) multilayer nanocomposite films inspired by wafer biscuits were constructed through a simple and efficient strategy. Verified by X-ray microscopy (XRM), the designed wafer biscuit-like structure provided abundant internal heat conduction pathways. As a result, the PPENK/MBN nanocomposite films with 39.2 wt% MBN content exhibited in-plane and out-of-plane thermal conductivities of 9.66 W m⁻¹ K⁻¹ and 1.13 W m⁻¹ K⁻¹, respectively, as well as excellent dielectric properties with a dielectric constant of 3.51 and a dielectric loss value as low as 0.010@15 GHz. Furthermore, the composites demonstrated a high thermal decomposition temperature of 511.3 °C. This study lays a foundation for the preparation of high thermal conductivity nanocomposites and provides possible applications in thermal management.