Recent advances in structural designs and fabrication of flexible polymer composite films with high thermal conductivity and electromagnetic interference shielding performance

Abstract

The miniaturization of chips in modern electronics introduces challenges to component functionality and longevity, primarily due to heat accumulation and electromagnetic interference (EMI). To ensure stable operation of smart electronic devices, enhancing both heat dissipation and EMI shielding is essential. Recently, flexible, thermally conductive and EMI shielding films have gained attention as promising alternatives to traditional thermal management and shielding materials for next-generation electronics. Polymer composites are especially valued for this purpose due to their low density, corrosion resistance, ease of processing, and effective thermal conductivity (TC) and EMI shielding properties. However, comprehensive analyses of flexible, thermally conductive EMI shielding polymer composites remain limited. This review examines the design and fabrication methods of flexible, polymer-based composite films with high TC and EMI shielding effectiveness. Additionally, it provides a concise summary of the benefits and limitations associated with each structural design and fabrication technique. Finally, it suggests potential directions for developing thermally conductive EMI shielding materials, which may serve as models for the rapidly advancing next generation of flexible electronic devices.