What could be the low-temperature limit of atomic layer deposition of platinum using MeCpPtMe3 and oxygen?

Abstract

Atomic layer deposition of Pt using MeCpPtMe₃ and O₂ is typically conducted in the temperature range of 200–300 ^oC. Here, we explore the low-temperature limit of this ALD process and reveal that highly dispersed Pt sub-nanometer clusters can be deposited even at room temperature by atmospheric-pressure ALD.