A silane-based adhesion promoter suitable for a multi-dielectric-layer coating on a digital microfluidic chip is reported. It measures >100× improvement in chip lifetime via transforming the bonding of the dielectric layers (Ta2O5 and Parylene C) from nonspecific to chemical. The refined chip-fabrication protocol also allows low EWOD actuation voltages down to 5 V.
J. Gao, T. Chen, C. Dong, Y. Jia, P. Mak, Mang-I. Vai and R. P. Martins, RSC Adv., 2015, 5, 48626 DOI: 10.1039/C5RA08202A
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