Issue 19, 2021
From the journal:

Nanoscale

Correction: Seaming the interfaces between topologically distinct metal–organic frameworks using random copolymer glues

Fang Wang,abc   Hongliang Wanga  and  Tao Li*a  

* Corresponding authors

a School of Physical Science and Technology, ShanghaiTech University, Shanghai 201210, China
E-mail: litao1@shanghaitech.edu.cn

b Shanghai Advanced Research Institute, Chinese Academy of Sciences, Shanghai 201203, China

c University of Chinese Academy of Sciences, Beijing 100049, China

Abstract

Correction for ‘Seaming the interfaces between topologically distinct metal–organic frameworks using random copolymer glues’ by Fang Wang et al., Nanoscale, 2019, 11, 2121–2125, DOI: 10.1039/C8NR09777A.

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Article information

DOI
https://doi.org/10.1039/D1NR90093E
Article type
Correction
Submitted
28 Apr 2021
Accepted
28 Apr 2021
First published
06 May 2021
This article is Open Access
Creative Commons BY license

Nanoscale, 2021,13, 9039-9039

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Correction: Seaming the interfaces between topologically distinct metal–organic frameworks using random copolymer glues

F. Wang, H. Wang and T. Li, Nanoscale, 2021, 13, 9039 DOI: 10.1039/D1NR90093E

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