Lihui Ou*ab,
Wenqi Longa,
Jianxing Huanga,
Yuandao Chenab and
Junling Jina
aCollege of Chemistry and Materials Engineering, Hunan University of Arts and Science, Changde 415000, China
bHunan Province Cooperative Innovation Center for the Construction & Development of Dongting Lake Ecologic Economic Zone, Hunan University of Arts and Science, Changde 415000, China. E-mail: oulihui666@126.com; Tel: +86-736-7186115
First published on 17th February 2017
The effect of the doped transition metal M (M = Ni, Pd and Pt) on CO2 reduction pathways and the origin of the electrocatalytic activity are investigated systematically by focusing on the CH4 and CH3OH formation pathways based on DFT calculations associated with the computational hydrogen electrode model. Our studies show that the doping of Ni, Pd and Pt can promote CO2 reduction into hydrocarbons and influence the selectivity of reduction pathways, in which the doping of Pt may be able to lead to the strongest catalytic activity. The adsorption behavior between reaction intermediates and surfaces is crucial and the interactions of intermediates with the catalysts should be moderate in order to efficiently catalyze CO2 reduction into CH4 and CH3OH, and avoid OH surface poisoning. The enhanced electrocatalytic activity of transition metal-doped Cu(111) surfaces may be owing to decreased overpotential and moderate electronic interactions between Cu and the doped transition metals. The doped Ni, Pd and Pt atoms can considerably decrease the overpotential and remove surface OH poisoning, in which the doped Pt can simultaneously reduce overpotential for CO formation and further reduction, and most easily remove OH, thus suggesting the best electrocatalytic activity. The moderate electron interaction between Cu and Pt and moderate upshift of the d-band center of Pt also explain why the Pt-doped Cu(111) surface has the best electrocatalytic activity for CO2 reduction. Two possible descriptors can be proposed in order to scale the electrocatalytic activity of Cu-based electrocatalysts for CO2 reduction, in which an ideal Cu-based electrocatalyst should be able to reduce barriers for CO formation and further reduction, and should have moderate electron interactions between Cu and the doped transition metals, and a moderate upshift of d-band center of the doped transition metals. In these ways, CO2 reduction pathways can be facilitated and the yield of hydrocarbons CH4 and CH3OH can be enhanced.
In surface-catalyzed reactions, the surface selectivity, activity and stability can be dramatically improved through the doping of transition metals to the surface of a host, and some novel properties that are not present on the parent metal surfaces are often exhibited.29–32 Thus, bimetallic Cu-based alloys with Cu-rich composition experimentally have been extensively used to improve CO2 electroreduction owing to the high overpotential and low current density of the pure Cu surface, such as Cu–Ni, Cu–Zn, Cu–Cd, Cu–Sn, Cu–Pb, Cu–Au, Cu–Ag, Cu–Pd and Cu–Pt.33–40 Compared to pure Cu, doping of other transition metals into Cu catalysts can modify the activation barrier for different steps, thereby leading to a reduction of overpotential and a major change of faradic efficiency. For example, Cu–Au alloy has higher faradic efficiency for CO2 electroreduction than that of pure Cu,37 and the experimental onset potential on the Cu–Au alloy was positively shifted, indicating that the overpotential of CO2 reduction can be reduced through the doping of Au.38 The Ni-doped Cu surface also displayed experimentally a superior catalytic activity with respect to the CH3OH synthesis from a mixture of CO, CO2 and H2 in comparison with pure Cu.39,40 Such an improvement was ascribed to the capability of Ni to promote CH3OH production by activating CO2 and stabilizing the intermediates owing to the higher oxygen affinity of Ni.41 Recently, a Pd–Cu catalyst for CO2 electroreduction was investigated.42 A sharp increase of the reduction current and positive shift of potential were observed on the Pd–Cu electrode compared with those for pure Cu, indicating that the doping of Pd could effectively suppress the HER and enhance the CO2 electroreduction activity. Actually, in more previous studies, both Pd single-crystal43 and oxide-supported Pd catalysts44,45 have also been shown to be catalytically active toward CH3OH synthesis from CO2 reduction. Given that Pt is also a metal with high chemical stability and oxygen affinity, the doping of Pt could be a promising approach to improve CO2 electroreduction. Thus, a Cu–Pt alloy with high Cu concentration was developed by Xiong and co-authors. The greatly improved chemical stability and superior electrocatalytic activity towards CO2 reduction were exhibited owing to the presence of Pt.36 Moreover, the alloying of Cu with Pt can lower the decomposition activation energy of formate by up to 13%.46 In the recent theoretical studies on CO2 reduction, density functional theory (DFT) was employed by Liu and co-authors to investigate the CH3OH synthesis reaction from CO2 reduction on transition metals-doped Cu(111) surfaces.47 The overall CH3OH yield was increased by the doped Ni, Pd and Pt compared with pure Cu, suggesting that the doping of Ni, Pd and Pt is able to promote the CH3OH production of the Cu(111) surface. Using DFT calculations associated with the standard hydrogen electrode model,48,49 Hirunsit and co-authors performed a systematic thermodynamic investigation for CO2 electroreduction into CH4 and CH3OH on Cu-based electrocatalysts with a Cu-rich composition of Cu3X (X is Ag, Au, Co, Ni, Pd, Pt, Rh and Ir). The investigation exhibited that a considerably different electrocatalytic activity was produced and hydrocarbon selectivity was changed compared with those on the pure Cu surface, in which on the mostly Cu-based alloy catalysts CH4 is more energetically favorable to be yielded than CH3OH, and CH3OH was found to be more favorable than CH4 production on Cu3Pd and Cu3Pt surfaces. On most surfaces the potential-limiting step is the CO protonation with the exception of on Cu3Au and Cu3Co surfaces. Most recently, the activation of CO2 on transition metal TM (TM = Fe, Co, Ni, Ru, Rh, Pd, Ag, Os, Ir, Pt and Au)-doped Cu(111) and Cu(100) surfaces was investigated with a dopant coverage of 1/9 ML by Qiu and co-authors using first-principle DFT calculations combined with a slab model.50,51 The studies predicted that Co, Ru and Os may be potential dopants to enhance the chemisorption of CO2 on both TM-doped Cu surfaces. However, previous experimental and theoretical studies only showed that the doped transition metals could reduce the thermodynamic overpotential of CO2 reduction and activate CO2 molecules. The exact CO2 electroreduction mechanisms and origin of electrocatalytic activation on Cu-based electrocatalysts still remain unclear, especially kinetic analysis of the elementary reaction steps and the relationship between the kinetic barriers and adsorption ability of the reaction intermediates. Essentially, the doping of transition metals can change the CO2 reduction pathways and reduce the activation barriers, thereby leading to the reduced overpotential and enhanced catalytic activity. A general understanding of the adsorption behavior, reaction mechanism and atomic-level origin of the electrocatalytic activity of Cu-based catalyst bimetallic surfaces will help us discover more efficient catalysts for a given reaction.
Based on the above analysis, Ni, Pd and Pt atoms as potential dopants may be able to enhance CO2 reduction into hydrocarbons on the Cu surface. Furthermore, Cu, Ni, Pd and Pt have the same face-centered cubic structure, which gives them a crystallographic match. Thus, the activation barriers of key steps can be maneuvered through the miscible bimetallic combinations of Cu with Ni, Pd and Pt, thereby resulting in improved surface catalytic activity and selectivity. Focusing on the CH4 and CH3OH formation pathways, the effect of the doped transition metal M (M = Ni, Pd and Pt) on the CO2 reduction pathways and the origin of the electrocatalytic activity are investigated systematically based on DFT calculations associated with the computational hydrogen electrode model. The (111) facet is chosen owing to its high selectivity for CH4 production. The major goal of this work is to examine the effects of the doped Ni, Pd and Pt atoms on the CO2 reduction pathways, surface electrocatalytic activity and selectivity in comparison with pure Cu catalyst. Some key factors that influence surface electrocatalytic activity, such as OH surface poisoning, the limiting potential, potential-limiting step and electronic interactions between Cu and Ni, Pd and Pt, are also demonstrated. The development of more superior electrocatalysts requires an essential understanding of these effects.
The minimum energy paths (MEPs) for each step of the CO2 reduction into hydrocarbons were determined by the climbing-image nudged elastic band (CI-NEB) method.64,65 The image of highest energy approximated the transition state of the optimized reaction coordinate, and the transition state images from the CI-NEB calculations were optimized by the quasi-Newton method, which minimizes the forces to find the saddle point. For each intermediate point in the MEPs, geometry optimization was also performed.
Fig. 1 The optimal reaction pathways of CO2 reduction into CH4 and CH3OH on: (a) pure Cu(111); (b) Ni-doped Cu(111); (c) Pd-doped Cu(111); and (d) Pt-doped Cu(111). |
Reaction paths | Pure Cu(111) | Ni-doped Cu(111) | ||
---|---|---|---|---|
ΔGreac (eV) | Eact (eV) | ΔGreac (eV) | Eact (eV) | |
a The asterisk (*) indicates that the species is adsorbed on the surface. The zero point energies (ZPE) for all species, which are obtained by the present DFT calculations, are included in the reaction free energy. For instance, for the reaction step of (CO + H)* → CHO*, the reaction free energy is calculated according to “E(CHO*) − E(CO + H)* + ZPE(CHO*) − ZPE(CO*) − ZPE(H*)”. | ||||
CO2(g) + H* → (CO + OH)* | 0.27 | 1.18 | −0.23 | 0.40 |
(CO + H)* → CHO* | 0.90 | 1.06 | 1.03 | 1.08 |
(CHO + H)* → CH2O* | −0.20 | 0.72 | −0.04 | 0.28 |
(CH2O + H)* → (CH2 + OH)* | 0.01 | 1.12 | 0.06 | 0.24 |
(CH2O + H)* → CH2OH* | 0.13 | 0.95 | −0.60 | 0.27 |
(CH2O + H)* → CH3O* | −1.05 | 1.86 | −0.08 | 0.24 |
(CH2OH + H)* → CH2* + H2O (l) | −0.19 | 0.66 | −0.13 | 0.58 |
(CH2OH + H)* → CH3OH (l) | −0.95 | 0.68 | −0.61 | 0.16 |
(CH2 + H)* → CH3* | −0.83 | 0.63 | −0.55 | 0.30 |
(CH3 + H)* → CH4* | −0.80 | 1.03 | −0.59 | 0.21 |
Reaction paths | Pd-doped Cu(111) | Pt-doped Cu(111) | ||
---|---|---|---|---|
ΔGreac (eV) | Eact (eV) | Ereac (eV) | ΔGreac (eV) | |
CO2(g) + H* → (CO + OH)* | 0.31 | 0.83 | 0.07 | 0.65 |
(CO + H)* → CHO* | 0.51 | 0.87 | 0.41 | 0.84 |
(CHO + H)* → CH2O* | −0.25 | 0.10 | −0.02 | 0.35 |
(CH2O + H)* → (CH2 + OH)* | 0.24 | 0.52 | 0.26 | 0.82 |
(CH2O + H)* → CH2OH* | −0.12 | 0.68 | −0.35 | 0.59 |
(CH2O + H)* → CH3O* | −0.80 | 0.06 | −0.62 | 0.17 |
(CH2OH + H)* → CH2* + H2O (l) | −0.01 | 0.33 | 0.10 | 0.60 |
(CH2OH + H)* → CH3OH (l) | −0.86 | 0.30 | −0.53 | 0.34 |
(CH3O + H)* → CH3OH (l) | −0.10 | 1.86 | −0.17 | 1.36 |
(CH3O + H)* → (CH3 + OH)* | 0.01 | 0.29 | −0.12 | 0.63 |
(CH2 + H)* → CH3* | −0.83 | 0.35 | −0.95 | 0.33 |
(CH3 + H)* → CH4* | −1.01 | 0.23 | −0.82 | 0.70 |
Based on the data in Tables 1 and 2, potential energy diagrams for formation of CH4 and CH3OH through CO2 reduction on the pure and transition metal Ni-, Pd- and Pt-doped Cu(111) surfaces are given in Fig. 2–5, respectively. We observed that the activation barriers of CO formation through initial CO2 reduction are considerably decreased by the doping of Ni, Pd and Pt, which is the rate-determining step of CO2 reduction on the pure Cu(111) surface (ca. 1.18 eV). Thus, the doping of Ni, Pd and Pt can activate CO2 and enhance the surface activity of Cu catalysts for CO2 reduction. Therefore, CO formation requires significantly lower activation barriers on Ni and Pt-doped Cu(111) surfaces (ca. 0.40 and 0.65 eV), whereas an activation barrier of 0.83 V is required after doping of Pd (see Fig. S1, S19 and S16†), which may be attributed to chemisorbed CO2 molecule being observed after doping of Ni and Pt by binding C atom at Ni and Pt sites, whereas only physisorbed CO2 was observed on the Pd-doped Cu(111) surface. For further CO reduction, CO hydrogenation into CHO was shown to be the preferred reaction pathway on the Ni-, Pd- and Pt-doped Cu(111) surfaces, as obtained on the pure Cu(111) surface.63 Our previous study and the work from Mei and co-authors63,66 have shown that CO prefers to desorb from Cu rather than to undergo further hydrogenation into CHO, which is in favor of dissociation back to CO and H. For example, CO hydrogenation to form CHO needs to overcome an activation barrier of 1.06 eV on the pure Cu(111) surface, whereas the inverse process only requires an activation barrier of 0.16 eV. The corresponding pathway has nearly equal activation barriers on the Ni-doped Cu(111) surface and the pure Cu(111) surface (1.06 eV vs. 1.08 eV), and a very low activation barrier for CHO dissociation back to CO was required (ca. 0.10 eV). Both steps may hinder CH4 and CH3OH formation in CO2 reduction on the pure and Ni-doped Cu(111) surfaces. In fact, a large amount of CO was observed experimentally on Cu for CH3OH synthesis.67 Based on our present calculations, the doping of Pd and Pt helps to improve the corresponding hydrogenation process. The activation barriers are 0.87 and 0.84 eV for CO hydrogenation after the doping of Pd and Pt, which are 0.19 and 0.22 eV lower than the corresponding barrier on the pure Cu(111) surface, respectively. Moreover, the activation barriers for CHO dissociation back to CO are increased on Pd- and Pt-doped Cu(111) surfaces (see Fig. S11 and S18†), which are 0.10 and 0.27 eV higher than the corresponding barriers on the pure Cu(111) surface, respectively. Improvement of further CO reduction may be attributed to the stronger CO adsorption. The adsorption energy of CO is 0.13 and 0.48 eV stronger after doping of Pd and Pt than that on the pure Cu(111) surface, respectively, i.e. the CO intermediate can be stabilized. Our present studies also show that the CO molecule can be stabilized by the doping of Ni. However, CO adsorption is stronger than that on the pure Cu(111) surface by 0.80 eV after doping of Ni, which is significantly higher than that on the Pd- and Pt-doped Cu(111) surfaces, thereby leading to a relatively poor improvement for further CO reduction into CHO. Although the doped Ni atom cannot significantly improve the further CO reduction into CHO, it makes CO formation the most facile to occur. According to our calculations, CO prefers to adsorb on the top sites of Ni, Pd and Pt. In comparison, the energetically most favorable site for CO adsorption is the fcc-hollow site on the pure Cu(111) surface.63
Fig. 2 Potential energy diagrams for the CH4 and CH3OH formation through CO2 reduction on the pure Cu(111) surface. TS stands for transition state. |
Fig. 3 Potential energy diagrams for CH4 and CH3OH formation through CO2 reduction on the transition metal Ni-doped Cu(111) surface. |
Fig. 4 Potential energy diagrams for CH4 and CH3OH formation through CO2 reduction on the transition metal Pd-doped Cu(111) surface. |
Fig. 5 Potential energy diagrams for CH4 and CH3OH formation through CO2 reduction on the transition metal Pt-doped Cu(111) surface. |
Subsequent further CHO reduction into the CH2O intermediate is the most favorable pathway among various possibilities on the pure and Ni-, Pd- and Pt-doped Cu(111) surfaces (see Fig. S4, S12 and S19†). The activation barriers of 0.28, 0.10 and 0.35 eV are required for this pathway, respectively, which are significantly lower than that on the pure Cu(111) surface (ca. 0.72 eV). Simultaneously, it can be found that the CHOH intermediate may be formed on the Pt-doped Cu(111) surface since CH2O and CHOH formation through CHO hydrogenation have nearly equal activation barriers (ca. 0.35 and 0.40 eV). We also observed that the further reduction of CHO is energetically comparable to CHO dissociation back to CO after the doping of Ni, Pd and Pt. Thus, although the doping of Ni has a poor improvement for further CO reduction, it considerably improves the further CHO reduction into key intermediate CH2O. The significantly lower activation barriers after the doping of Ni, Pd and Pt may be owing to the stronger CHO adsorption. CHO prefers to bind at Ni, Pd and Pt sites through a C atom after the doping of Ni, Pd and Pt, which is 0.67, 0.29 and 0.68 eV more stable than that on the pure Cu(111) surface, respectively. Thus, the CHO intermediate is able to be stabilized and further CHO reduction can be promoted by the doping of Ni, Pd and Pt atoms.
On the Ni-doped Cu(111) surface, CH2O hydrogenation into CH3O and CH2OH, and hydrogenative dissociation into CH2 may be parallel pathways since they have very low and almost equal activation barriers. The barriers for the corresponding pathways are 0.24, 0.27 and 0.24 eV, respectively. Only CH3O formation is the most preferred pathway in further CH2O reduction on the Pd-doped Cu(111) surface with a very low activation barrier of 0.06 eV, which is a non-activated process, as shown in Fig. S13.† On the Pt-doped Cu(111) surface, CH3O and CH2OH formations through CH2O hydrogenation are the most favorable pathways among four possibilities owing to the relatively lower activation barriers (0.21 and 0.59 eV), as shown in Fig. S20.† However, considerably higher activation barriers are required on the pure Cu(111) surface for further CH2O reduction compared with that on Ni-, Pd- and Pt-doped Cu(111), and the most favorable reduction pathway is hydrogenation of CH2O into CH2OH with an activation barrier of 0.95 eV. The significantly lower barriers may be owing to the doping of Ni, Pd and Pt stabilizing the CH2O intermediate, which adsorbs on the Ni-, Pd- and Pt-doped Cu(111) surfaces through the C atom directly interacting with Ni, Pd and Pt and O atoms interacting with Cu and transition metal M (M = Ni, Pd and Pt). In comparison, the adsorption of CH2O intermediate on the Ni-, Pd- and Pt-doped Cu(111) surfaces is 0.55, 0.19 and 0.31 eV more stable than that on pure Cu(111), respectively. On the Pt-doped Cu(111) surface, CH2 and CH2OH may be able to be formed through CHOH hydrogenative dissociation and direct hydrogenation owing to almost identical activation barriers (ca. 0.53 and 0.54 eV). However, CHOH dissociation back into CHO only requires a very low activation barrier of ca. 0.04 eV, as shown in Fig. S4 and S19,† which is a non-activated process. Thus, although CHOH can be formed on the Pt-doped Cu(111) surface, its further reduction may not be able to occur.
Further reduction of CH2OH intermediate into CH3OH is more favorable to occur with an activation barrier as low as 0.16 eV on the Ni-doped Cu(111) surface, which is significantly more facile in contrast with CH3O further reduction, as shown in Fig. S6 and S7.† Thus, CH3OH can be formed easily by CH2OH hydrogenation after the doping of Ni atom. CH3O hydrogenative dissociation into the CH3 intermediate is the most preferred pathway in further CH3O reduction on the Pd- and Pt-doped Cu(111) surfaces with relatively lower activation barriers of 0.29 and 0.63 eV, respectively. On the Pt-doped Cu(111) surface, CH3OH and CH2 can be also formed easily through hydrogenation and hydrogenative dissociation in further reduction of CH2OH with relatively lower activation barriers of 0.34 and 0.60 eV, respectively. Thus, the doping of Pt may lead to simultaneous formation of CH2, CH3 and CH3OH, as shown in Fig. S22 and S23.† Our previous studies also suggested that CH3OH and CH2 were formed on the pure Cu(111) surface through further reduction of CH2OH with activation barriers of 0.68 and 0.66 eV, respectively.63 However, the doping of Ni and Pt leads to a significant decrease of the activation barriers for CH3OH formation. Thus, further CH2OH reduction can be improved through the doped Ni and Pt atoms, whereas the doping of Pd promotes CH3O formation and further reduction, leading to enhanced CH4 and CH3OH yields. Further reduction of CH3O was not considered on the pure Cu(111) surface owing to the significantly higher activation barrier of CH3O formation. The significant promotion effect on further CH2OH reduction may be owing to the stronger CH2OH adsorption after doping of Ni and Pt atoms. The binding of CH2OH is 0.39 and 0.51 eV more stable than that on the pure Cu(111) surface, and it prefers to bind at the top site of the Ni and Pt atoms by C atom on the Ni- and Pt-doped Cu(111) surfaces. Compared with that on the pure Cu(111) surface, CH3O on the Ni-doped Cu(111) surface is 0.05 eV more stable. However, CH3O is 0.09 and 0.25 eV less stable after the doping of Pd and Pt than that on the pure Cu(111) surface, which may explain why the CH3 intermediate can be formed through hydrogenative dissociation of CH3O after doping of Pd and Pt.
Based on the above analyses, CH4 production possibly occurs through serial CH2 hydrogenation on the Ni- and Pt-doped Cu(111) surfaces or direct CH3 hydrogenation on the Pd- and Pt-doped Cu(111) surfaces. The activation barriers for CH2 hydrogenation into CH3 and CH3 hydrogenation into CH4 are 0.30 and 0.21 eV, 0.35 and 0.23 eV, 0.33 and 0.70 eV on Ni, Pd- and Pt-doped Cu(111) surfaces (see Fig. S8, S15 and S24†), respectively, which are notable lower than that for the corresponding pathways on the pure Cu(111) surface (0.63 eV and 1.03 eV, respectively). Based on our present calculations, the doping of Ni and Pt helps to stabilize CH2 and CH3 intermediates and enhance the corresponding hydrogenation processes, in which CH2 and CH3 are 0.43 and 0.22 eV, 0.18 and 0.23 eV more stable after doping of Ni and Pt, respectively. Although CH3 is 0.07 eV less stable on the Pd-doped Cu(111) surface, the doping of Pd still can improve further CH3 reduction into CH4. This may be attributed to different electronic interactions among Ni and Pd, Ni and Pt, which will be confirmed by subsequent electronic structure analysis. Additionally, OH can be formed during the course of CO2 reduction into CH4 and CH3OH on the pure and Ni-, Pd- and Pt-doped Cu(111) surfaces, which may lead to poisoning of surface active sites. Thus, the OH removal to form H2O is an important step for CO2 reduction. The activation barriers for OH removal are 1.09, 0.68, 0.56 and 0.21 eV on pure and Ni-, Pd- and Pt-doped Cu(111) surfaces, respectively, as shown in Fig. 6. We observe that the doping of Ni, Pd and Pt atoms significantly decreases the activation barriers of OH removal, which is 0.41, 0.53 and 0.88 eV lower than the corresponding barrier on pure Cu(111), respectively. Therefore, the reduced value of the activation barrier after the doping of Ni atom is lower than that on the Pd- and Pt-doped Cu(111) surfaces. The significant improvement of OH removal on the Pd- and Pt-doped Cu(111) may be owing to the weaker OH adsorption, in which the adsorption of OH is 0.16 and 0.26 eV less stable than that on the pure Cu(111) surface, respectively, whereas the doping of Ni makes OH adsorption 0.08 eV stronger. Thus, the doping of metals with less affinity toward OH, such as Pd and Pt, improves the OH removal step and proves to be more efficient than pure Cu and high OH affinity metal Ni.
Fig. 6 The minimum energy pathways of OH removal to form H2O on pure and Ni-, Pd- and Pt-doped Cu(111) surfaces. |
On this basis, the effect of the doped Ni, Pd and Pt atoms on the selectivity of the reaction pathways and reduction production can be revealed. The doped Ni, Pd and Pt atoms changed the rate-determining step of CO2 reduction, which is (CO2 + H)* → (CO + OH)* on the pure Cu(111) surface, whereas it is changed into (CO + H)* → CHO* after the doping of Ni, Pd and Pt. The activation barriers of rate-determining steps are also reduced, which are 0.10, 0.31 and 0.34 eV lower than that of the corresponding process on the pure Cu(111) surface, respectively. Simultaneously, we observed that the activation barriers in overall optimal pathways for CO2 reduction into CH4 and CH3OH are 1.88, 1.12, 1.18 and 0.90 eV on the pure and Ni-, Pd- and Pt-doped Cu(111) surfaces, respectively, as shown in Fig. 2–5, in which the barriers are considerably decreased compared with that on pure Cu(111) and the doping of Pt may be able to lead to the strongest catalytic activity owing to the most reduced value. Therefore, higher CH4 and CH3OH yields can be expected on the Ni-, Pd- and Pt-doped Cu(111) surfaces. The higher reactivity of Ni-, Pd- and Pt-doped Cu(111) surfaces is also consistent with the previous experimental observations.36,39–42 The adsorption behavior of intermediates may be able to determine CO2 reduction activity based on the above discussion. The most stable adsorption sites and adsorption energies for the possible intermediates involved in CO2 reduction into CH4 and CH3OH on the pure and Ni-, Pd- and Pt-doped Cu(111) surfaces are given in Table 3. It is clear that the doping of Ni, Pd and Pt atoms can stabilize the relatively weaker adsorbed C- and O-containing intermediates on the pure Cu(111) surface, such as CO, CHO and CH2O, where C and O atoms directly interact with the doped Ni, Pd and Pt atoms, thereby resulting in easier formation and reduction of CO, CHO and CH2O in spite of the doped Ni atom not notably improving further CO reduction into CHO owing to excessively strongly adsorbed CO. However, the stronger adsorbed intermediates, such as CH3O and OH, are destabilized by the doped Pd and Pt atoms in comparison with pure Cu(111), which make CH3O formation and further reduction able to occur on the Pd- and Pt-doped Cu(111) surfaces and OH removal be easier. Owing to the high carbon and oxygen affinity of Ni, all intermediates can be stabilized by the doped Ni atom in CO2 reduction and the Ni-doped Cu(111) surface has the strongest adsorption ability among the Ni-, Pd- and Pt-doped Cu(111) surfaces, whereas the doping of Pd and Pt leads to the weakest and moderate adsorption of most intermediates, respectively, which may explain why Pt-doped Cu(111) surfaces have the best catalytic activity for CO2 reduction. Thus, it is concluded that moderate adsorbed intermediates on the Cu-based electrocatalyst surfaces will favor CO2 reduction.
Species | Cu(111) | Ni-doped Cu(111) | Pd-doped Cu(111) | Pt-doped Cu(111) | ||||
---|---|---|---|---|---|---|---|---|
Sites | Eads (eV) | Sites | Eads (eV) | Sites | Eads (eV) | Sites | Eads (eV) | |
COOH | Bridge | −1.56 | Bridge | −1.95 | Bridge | −1.69 | Bridge | −2.03 |
CO | fcc | −0.80 | Top | −1.59 | Top | −0.93 | Top | −1.28 |
CHO | fcc | −1.25 | Top | −1.93 | Top | −1.54 | Top | −1.93 |
CH2O | fcc | −0.05 | fcc | −0.60 | fcc | −0.24 | fcc | −0.36 |
CHOH | fcc | −2.50 | Top | −3.02 | fcc | −2.60 | Top | −2.95 |
CH2OH | fcc | −0.90 | fcc | −1.29 | fcc | −1.11 | fcc | −1.41 |
CH3O | fcc | −2.28 | fcc | −2.33 | fcc | −2.19 | hcp | −2.03 |
CH2 | fcc | −2.94 | fcc | −3.37 | fcc | −2.90 | fcc | −3.12 |
CH3 | fcc | −1.36 | fcc | −1.58 | Top | −1.29 | Top | −1.59 |
OH | fcc | −3.16 | fcc | −3.24 | hcp | −3.00 | hcp | −2.90 |
The calculated limiting potentials (E) and reaction free energies (ΔGreac) at 0.17 V vs. RHE in CO2 electroreduction to CH4 and CH3OH on pure and Ni-, Pd-, and Pt-doped Cu(111) surfaces are listed in Tables 4 and 5. We found that the potential-limiting step is CHO formation (CO* + H+ + e− → CHO*) with the most positive reaction free energy at 0.17 V vs. RHE on the pure and Ni-, Pd- and Pt-doped Cu(111) surfaces, requiring limiting potentials of −0.60, −0.72, −0.44 and −0.40 V vs. RHE by the CHE model, respectively. It can be observed that the limiting potentials are positively shifted after the doping of Pd and Pt atoms, whereas it is more negative after the doping of Ni atom, implying that the doped Pd and Pt atoms can decrease the overpotential of this pathway. The strongest CO adsorption on the Ni-doped Cu(111) surface may induce the protonation to be potentially limited, resulting in a relatively high overpotential for CHO formation. The formation of CHO is also the rate-determining step in CO2 reduction on the Ni-, Pd- and Pt-doped Cu(111) surfaces based on the above kinetic analyses, and its activation barriers are lower after the doping of Pd and Pt atoms, and slightly higher after the doping of Ni atom, compared with that on the pure Cu(111) surface. Although the doped Ni atom leads to more negative limiting potential (−0.72 V) and more positive reaction free energy (0.89 eV) for CHO formation, it can notably shift the limiting potential and reaction free energy to more positive (1.11 V) and more negative values (−0.94 eV) for CO formation (CO2* + H+ + e− → (CO + OH)*), respectively, in which the formation of CO has a slightly negative limiting potential of −0.07 V and a positive reaction free energy of 0.24 eV on the pure Cu(111) surface. The above kinetic studies also show that the activation barrier of CO formation is significantly decreased by the doping of Ni atom. Thus, the decreased overpotential for CO formation can be concluded after the doping of Ni. As shown in Table 5, the doping of Pt atom also can significantly shift the limiting potential of CO formation to a more positive value and make the reaction free energy more negative, thus leading to decrease of the overpotential. However, the limiting potential and reaction free energy of CO formation after the doping of Pd are almost unchanged compared with that on the pure Cu(111) surface. These may be owing to chemisorbed CO2 being observed on Ni- and Pt-doped Cu(111) surfaces and only physisorbed CO2 is formed on the Pd-doped Cu(111) surface. Simultaneously, the limiting potentials of OH removal are also shifted positively after the doping of Ni, Pd and Pt, which are 0.06, 0.24 and 0.36 V more positive than that on the pure Cu(111) surface, respectively, leading to the reduction of the overpotential. Therefore, the Pt-doped Cu(111) surface with the weakest OH adsorption has the most positive limiting potential and the most negative reaction free energy, which is in agreement with the above kinetic analyses, suggesting that the doped metals with less affinity toward OH could decrease surface OH poisoning and enhance the catalytic activity. Thus, the best electrocatalytic activity of the Pt-doped Cu(111) surface for CO2 reduction may be able to be attributed to the simultaneous reduction of overpotential for CO formation and further reduction, and the easiest OH removal.
Possible reduction steps | Pure Cu(111) | Ni-doped Cu(111) | ||
---|---|---|---|---|
E (V) | ΔGreac (eV) | E (V) | ΔGreac (eV) | |
(a) CO2* + H+ + e− → (CO + OH)* | −0.07 | 0.24 | 1.11 | −0.94 |
(b) CO* + H+ + e− → CHO* | −0.60 | 0.77 | −0.72 | 0.89 |
(c) CHO* + H+ + e− → CH2O* | 0.45 | −0.28 | 0.32 | −0.15 |
(d) CH2O* + H+ + e− → (CH2 + OH)* | 0.38 | −0.21 | 0.10 | 0.07 |
(e) CH2O* + H+ + e− → CH3O* | 1.26 | −1.09 | 0.76 | −0.59 |
(f) CH2O* + H+ + e− → CH2OH* | 0.23 | −0.06 | 0.07 | 0.10 |
(g) CH2OH* + H+ + e− → CH3OH (l) | 1.19 | −1.02 | 0.76 | −0.59 |
(h) CH2OH* + H+ + e− → CH2* + H2O (l) | 0.43 | −0.26 | 0.40 | −0.23 |
(i) CH3O* + H+ + e− → CH3OH (l) | 0.17 | 0.00 | 0.07 | 0.10 |
(j) CH3O* + H+ + e− → (CH3 + OH)* | 0.24 | −0.07 | 0.22 | −0.05 |
(k) CH2* + H+ + e− → CH3* | 1.05 | −0.88 | 0.84 | −0.67 |
(m) CH3* + H+ + e− → CH4* | 1.07 | −0.90 | 0.86 | −0.69 |
(n) OH* + H+ + e− → H2O (l) | 0.12 | 0.05 | 0.18 | −0.01 |
Possible reduction steps | Pd-doped Cu(111) | Pt-doped Cu(111) | ||
---|---|---|---|---|
E (V) | ΔGreac (eV) | E (V) | ΔGreac (eV) | |
(a) CO2* + H+ + e− → (CO + OH)* | −0.11 | 0.28 | 0.82 | −0.65 |
(b) CO* + H+ + e− → CHO* | −0.44 | 0.61 | −0.40 | 0.57 |
(c) CHO* + H+ + e− → CH2O* | 0.35 | −0.18 | 0.08 | 0.09 |
(d) CH2O* + H+ + e− → (CH2 + OH)* | −0.08 | 0.25 | −0.16 | 0.33 |
(e) CH2O* + H+ + e− → CH3O* | 0.97 | −0.80 | 0.69 | −0.52 |
(f) CH2O* + H+ + e− → CH2OH* | 0.25 | −0.08 | 0.43 | −0.26 |
(g) CH2OH* + H+ + e− → CH3OH (l) | 0.93 | −0.76 | 0.62 | −0.45 |
(h) CH2OH* + H+ + e− → CH2* + H2O (l) | 0.11 | 0.06 | 0.00 | 0.17 |
(i) CH3O* + H+ + e− → CH3OH (l) | 0.21 | −0.04 | 0.36 | −0.19 |
(j) CH3O* + H+ + e− → (CH3 + OH)* | 0.01 | 0.16 | 0.32 | −0.15 |
(k) CH2* + H+ + e− → CH3* | 1.03 | −0.86 | 1.11 | −0.94 |
(m) CH3* + H+ + e− → CH4* | 1.14 | −0.97 | 0.84 | −0.67 |
(n) OH* + H+ + e− → H2O (l) | 0.36 | −0.19 | 0.48 | −0.31 |
Fig. 7 Local density of states of pure and transition metals Ni-, Pd- and Pt-doped Cu(111) surfaces: (a) s orbital of Cu and (b) d orbital of Cu. |
Fig. 8 Local density of states of pure and transition metals Ni-, Pd- and Pt-doped Cu(111) surfaces: (a) s orbitals of Ni, Pd and Pt; and (b) d orbitals of Ni, Pd and Pt. |
In the mean time, we also observed that the s and d states of Ni, Pd and Pt in Ni-, Pd- and Pt-doped Cu(111) are changed significantly near the Fermi energy level compared with those of pure Ni, Pd and Pt, as shown in Fig. 8(a) and (b). The considerably higher LDOS near the Fermi energy level shows that electrons in the s state of Cu are transferred into the s and d states of Ni, Pd and Pt. The highest LDOS in the d states of Ni in Ni-doped Cu(111) may imply that the most electron transfer and strongest interactions occur between Cu and Ni. Thus, the present studies explain why the reaction intermediates have the strongest adsorption on the Ni-doped Cu(111) surface. The relatively weaker interaction between Cu and transition metals Pd and Pt may result in weaker adsorption of intermediates.
The d-band center of surface atoms, εd, is a key parameter that influences surface adsorption characteristics,69,70 and its upshift and downshift can be used to judge the catalytic activity of the electrocatalysts.71–73 The shift of the d-band center into a lower energy level (downshift) corresponds to the weaker adsorption of reaction intermediates, whereas the shift into a higher energy level (upshift) corresponds to the stronger adsorption. Thus, the d-band centers of surface atoms were calculated in pure and Ni-, Pd- and Pt-doped Cu(111), which is the first moment of the projected d-band density of states on the surface atoms referenced to the Fermi energy level. The corresponding values for surface atoms are listed in Table 6. It was found that there is a slight and considerably upshift of the d-band center of surface Cu and Ni atoms (ca. 0.02 and 0.74 eV) in Ni-doped Cu(111) compared with that of the pure metal surfaces, respectively, whereas that of surface Cu atoms is not changed after the doping of Pd and Pt atoms. The relatively lower upshift of the d-band center of the surface Pt atom in Pt-doped Cu(111) is also observed (ca. 0.20 eV). However, the d-band center of the surface Pd atom is downshifted significantly in Pd-doped Cu(111) (ca. −0.34 eV) compared with that of pure Pd. Thus, we conclude that the doping of Ni and Pd can lead to the strongest and weakest adsorption of reaction intermediates on the Ni and Pd-doped Cu(111) surfaces, respectively. Furthermore, the significant upshift of the d-band center of the surface Ni atom and the strongest interaction between CO and the Ni-doped Cu(111) surface may also be able to explain why further CO reduction has the most positive activation barrier and the most negative limiting potential on the Ni-doped Cu(111) surface among the Ni-, Pd- and Pt-doped Cu(111) surfaces, whereas the significant downshift of the d-band center of the surface Pd atom in Pd-doped Cu(111) explains why only physisorbed CO2 is observed, which even leads to slightly more negative limiting potential for CO formation in comparison with that on pure Cu(111). Accordingly, we infer that the dopant Pt with moderate upshift of the d-band center is the most capable of enhancing the electrocatalytic activity of Cu catalysts for CO2 reduction, which confirms the above thermodynamic and kinetic studies.
Surface atoms | εd (eV) | Δεda (eV) | |
---|---|---|---|
a Δεd represents difference of the d-band center, εd of surface atoms between surface atoms in Ni-, Pd- and Pt-doped Cu(111) and pure surface atoms. | |||
Pure Cu | −2.52 | — | |
Pure Ni | −1.79 | — | |
Pure Pd | −2.02 | — | |
Pure Pt | −2.69 | — | |
Ni-doped Cu(111) | Cu | −2.50 | 0.02 |
Ni | −1.05 | 0.74 | |
Pd-doped Cu(111) | Cu | −2.52 | 0.00 |
Pd | −2.36 | −0.34 | |
Pt-doped Cu(111) | Cu | −2.52 | 0.00 |
Pt | −2.49 | 0.20 |
Based on our present calculations, CO formation and further reduction are key reaction steps during the course of CO2 reduction into hydrocarbons. CO2 reduction on the Cu catalyst can be promoted and higher hydrocarbons yield may be able to be expected by the doping of transition metals. On the basis of the above discussion, two possible descriptors can be proposed in order to scale the electrocatalytic activity of Cu-based alloy catalysts for CO2 reduction. One is activation barriers of CO formation and further reduction. The transition metal-doped Cu-based alloy electrocatalysts with lower activation barriers for CO formation and further reduction will exhibit better catalytic activity for CO2 reduction. For example, the barriers of CO formation are decreased by the doped Ni, Pd and Pt atoms, and those of further CO reduction on the Pd- and Pt-doped Cu(111) surfaces are also reduced. The chemisorbed CO2 on Cu-based electrocatalyst surfaces will favor the formation of the key intermediate CO, i.e. the doping of Ni and Pt lead to the formation of chemisorbed CO2 and make CO formation easier. The moderately adsorbed CO on Cu-based electrocatalyst surfaces can avoid CO desorption and poisoning on surface active sites, thereby being in favor of further CO reduction, i.e. the Ni-doped Cu(111) surface has excessively strong CO adsorption, resulting in the highest barrier and the most negative limiting potential for further CO reduction among pure, Ni-, Pd- and Pt-doped Cu(111) surfaces. Another is the electronic structure of the transition metals-doped Cu-based electrocatalysts. The moderate interactions between Cu and transition metals and the moderate upshift of the d-band center of the doped transition metals in transition metal-doped Cu(111) will favor CO2 reduction, which can lead to moderate adsorption of intermediates. For example, the Ni-doped Cu(111) surface with the strongest interaction between Cu and Ni and the most upshift of the d-band center of the Ni atom, and Pd-doped Cu(111) surface with the downshift of the d-band center of Pd atom have relatively poorer electrocatalytic activity for CO2 reduction than the Pt-doped Cu(111) surface. Thus, an ideal Cu-based alloy electrocatalyst toward CO2 reduction should be able reduce activation barriers for CO formation and further reduction, and should have moderate electron interactions between Cu and the doped transition metals, and a moderate upshift of the d-band center of the doped transition metals. In these ways, CO2 reduction pathways can be facilitated and the yield of hydrocarbons CH4 and CH3OH can be enhanced.
The enhanced electrocatalytic activity of the transition metal-doped Cu(111) surfaces may be owing to the decrease of the overpotential and electronic interactions between Cu and the transition metals. Further reduction of CO into CHO is the potential-limiting step on the pure and Ni-, Pd- and Pt-doped Cu(111) surfaces. The doping of Pd and Pt atoms can reduce the overpotential of CHO formation, whereas the doped Ni makes it slightly higher in comparison with pure Cu(111). The overpotential of CO formation is notably decreased after the doping of Ni, which is the rate-determining step on pure Cu(111). The significantly reduced overpotential for CO formation is also observed on the Pt-doped Cu(111). However, a slightly increased overpotential is obtained on the Pd-doped Cu(111) for CO formation. Simultaneously, the Pt-doped Cu(111) surface has the lowest overpotential for OH removal, suggesting that the doped metals with less affinity toward OH could enhance the catalytic activity. Thus, the doped Pt can simultaneously reduce the overpotential for CO formation and further reduction and most easily remove OH. The electronic structures analyses show that there is a moderate interaction between Cu and Pt and a moderate upshift of the d-band center of Pt. These analyses confirm why the Pt-doped Cu(111) surface has the best electrocatalytic activity for CO2 reduction.
Two possible descriptors can be proposed in order to scale the electrocatalytic activity of Cu-based electrocatalysts for CO2 reduction. One is activation barriers of CO formation and further reduction. The transition metal-doped Cu-based electrocatalysts with lower barriers will exhibit better catalytic activity for CO2 reduction. The chemisorbed CO2 on the Cu-based electrocatalyst will favor the formation of the key intermediate CO. The moderate adsorbed CO on the Cu-based electrocatalyst can avoid CO desorption and poisoning on surface active sites, thereby being in favor of further reduction of CO. Another is the electronic structure of the Cu-based electrocatalysts. The moderate interactions between Cu and the doped transition metals and the moderate upshift of the d-band center of the doped transition metals will be in favor of CO2 reduction. Thus, an ideal Cu-based electrocatalyst should be able to reduce barriers for CO formation and further reduction, and should have moderate interactions between Cu and the doped transition metals, and a moderate upshift of d-band center of the doped transition metals. In these ways, CO2 reduction pathways can be facilitated and the yield of hydrocarbons CH4 and CH3OH can be enhanced.
Footnote |
† Electronic supplementary information (ESI) available. See DOI: 10.1039/c6ra28815d |
This journal is © The Royal Society of Chemistry 2017 |