Liam
Johnston
a,
Jorit
Obenlüneschloß
b,
Muhammad Farooq
Khan Niazi
a,
Matthieu
Weber
a,
Clément
Lausecker
a,
Laetitia
Rapenne
a,
Hervé
Roussel
a,
Camilo
Sanchez-Velazquez
a,
Daniel
Bellet
a,
Anjana
Devi
bc and
David
Muñoz-Rojas
*a
aGrenoble INP, CNRS, LMGP – Grenoble, Univ. Grenoble Alpes, France. E-mail: david.munoz-rojas@grenoble-inp.fr
bInorganic Materials Chemistry, Ruhr Univ. Bochum, 44801, Bochum, Germany
cLeibniz Institute for Solid State and Materials Research, 01069, Dresden, Germany
First published on 23rd July 2024
Spatial atomic layer deposition (SALD) is a promising thin film deposition technique that enables fast, large-scale deposition and nanoscale thickness control by utilizing spatially separated precursor vapors and a substrate-specimen relative motion, while being feasible in atmospheric pressure conditions. This study explores the use of a non-pyrophoric precursor, Zn(DMP)2, in open-air SALD to produce ZnO, and compares the SALD processing speed, and thin film properties, as well as the environmental impact of using this precursor versus the more conventional diethylzinc (DEZ), whose pyrophoricity discourages open-air processing. For this purpose, a life cycle analysis (LCA) study was carried out. Our investigation shows that Zn(DMP)2 open-air SALD can yield ZnO films faster than conventional ALD using DEZ, producing high purity ZnO films with a growth per cycle of 0.7 Å at 180 °C, which corresponds to 184 Å min−1 maximal growth rate. Emphasizing practical applications, the conformality of the ZnO coating produced around silver nanowire (AgNW) networks by Zn(DMP)2 open-air SALD and the functionality of these protective coatings has also been demonstrated. The resulting transparent conductive nanocomposites had a substantially improved durability on par with their DEZ-synthesized counterparts.
Currently, the overwhelming majority of ZnO ALD processes use diethylzinc (DEZ) as the Zn precursor,9 whose popularity stems from its high reactivity and volatility, allowing for very short pulse times in temporal ALD to achieve surface saturation and thus higher growth rates (which can be expressed in Å min−1) than many other ALD processes. However, DEZ is also known for being highly pyrophoric, leading to higher costs associated with safety and transport, particularly when using open-air setups (i.e. setups characterized by the absence of a physical barrier between the reaction region and the outside air). Therefore, alternative non-pyrophoric precursors are needed. In this sense, the current state of the art in Zn precursors for ALD is represented in Table 1, where one non-pyrophoric precursor stands out for its high growth per cycle (GPC) despite low deposition temperatures: Zn(DMP)2 or bis-3-(N,N-dimethylamino)propyl zinc as suggested by Mai et al. for plasma-enhanced ALD (PEALD).10
Zn precursor | Pyrophoricity | Co-reactant | Precursor delivery T (°C) | Substrate T (°C) | GPC (Å) | Ref. |
---|---|---|---|---|---|---|
Zn(C 2 H 5 ) 2 (DEZ) | Yes | H 2 O | Ambient | 110–170 | 1.8–2 | 9, 11, 12 |
O 2 plasma | — | 75–150 | 1.9–2.2 | 13 | ||
Zn(DMP) 2 | No | H 2 O | 35 | 60–140 | 0.49–1.1 | 14 |
O 2 plasma | — | 60–140 | 0.42–0.69 | 10 | ||
EtZn(damp)2 | No | H2O2 | 135 | 200 | 1.25 | 15 |
Zn(eeki)2 | No | H2O | 100 | 175–300 | 1.3 | 16 |
Zn(CH3)2 | Yes | H2O | −25 | 80–150 | 1.8 | 8 |
Zn(OOCCH3)2 | No | H2O | 230–250 | 280–350 | 1.8 | 8 |
Zn(DMP)2 is non-pyrophoric and solid at room temperature (demonstrated in Fig. S13†) while having a low melting point of 45 °C, making it safer and easier to work with than DEZ, in particular when using an open-air setup. It could be used in a Zn(DMP)2 + H2O thermal ALD process to yield a GPC of 1.1 Å,14 which is still less than the GPC of 1.8–2.0 Å that is typically obtained with DEZ (though this value varies strongly in the literature).9 While Zn(DMP)2 has shown a great potential as a replacement to DEZ in temporal ALD processes (i.e. ALD involving sequential precursor pulses and purges that span the entire substrate),14,17 its suitability for fast-deposition over large areas, such as the obtained with spatial ALD (SALD), is yet to be evaluated. This is the prevailing aim of the work.
SALD is a recent approach that can offer the same advantages as ALD, but with growth rates typically in the 60–600 Å min−1 range which are comparable to CVD rates.18 At the same time, processing is even feasible in the open-air19 allowing for easier up-scaling and no extra costs associated to vacuum techniques. Various approaches can be considered to perform SALD. In this work, the close-proximity approach is used,20 by continuously injecting the precursors at different points on the substrate surface, and moving the substrate to cyclically expose it to the desired precursor pulse steps, which drastically reduces the needed pulse time to saturate the surface. In this approach, the precursors are separated by a N2 inert gas barrier preventing the precursors from meeting in the gas phase and preventing the outside air from reacting with the metal precursor.
In this study, the open-air SALD using a non-pyrophoric precursor such as Zn(DMP)2 was investigated to test whether (i) good quality ZnO thin films can indeed be produced, and (ii) to compare the obtained films to films produced using conventional ALD using DEZ in terms of growth rate, structural properties, and chemical properties. The conformality of the deposition technique around silver nanowire (AgNW) networks was also investigated as well as the functionality of the fabricated ZnO/AgNW nanocomposite networks, which is tested by characterizing the stability of these nanocomposites under electrical stress.
Fig. 1 Scheme of the synthesis of the Grignard reagent (DMP)MgCl from (DMP)Cl and Grignard reaction producing Zn(DMP)2. |
The manifold used in this study contained two metal precursor outflows, such that one pass corresponds to 2 successive ALD cycles, and therefore one oscillation yields 4 ALD cycles. Since the ALD cycle must start with the co-reactant independently of the direction of movement, there are 3 total co-reactant outflows. To prevent cross-talking of the precursors and ensure ALD conditions, these 2 precursor lines and 3 co-reactant lines are separated by a total of 6 N2 inert gas barriers, while an additional 12 exhausts are placed to evacuate the excess chemical species and ALD by-products. All manifold outlet lines have a channel thickness of 0.5 mm and a width of 30 mm.
N2 is used both as the carrier gas for the reactive species and as the barrier flow preventing precursor cross-talk. A flow rate QN was split between the 6 inert gas barriers by the manifold, while the precursors were volatilized in N2 gas using bubblers for the metallic precursor Zn(DMP)2 (subscript M, for metal source), the co-reactant H2O (subscript O, for oxygen source), each with separated flow rate units to the bubbler QB,M and QB,O. These precursor vapors were further diluted with N2 mass flows QD,M and QD,O. Three heaters, corresponding to the substrate (TS), the bubbler (TB), and the line, are used to maintain a constant temperature of these components. The line is kept around 10 °C hotter than the bubbler to prevent recondensation of the volatilized species. The substrate holder is heated to a temperature TS. Owing to the lower volatility of Zn(DMP)2versus DEZ,10 the bubbler had to be heated to satisfyingly produce the precursor vapors needed. The complete set of parameters along with substrate oscillation speed vS and gas flow rates are given in Table S1.†
To test the electrical stability of the nanocomposites, a voltage ramp of 0.1 V min−1 was applied between two electrodes (prepared through the application of silver paste) separated by 2 cm of ZnO-coated AgNW networks on a soda-lime glass substrate for different ZnO coating thicknesses. The electrical setup used here was similar to that of Khan et al.25 except the samples and electrodes here were half the width (perpendicular to the current flow). Since the electrodes are separated by a similar distance as previous experiments and the voltage conditions are identical, the local electric field and thus the local Joule heating effect is also similar. The networks were thus brought to a breaking point situated at a certain “failure” voltage along the chosen voltage ramp as per previous experiments on bare AgNW networks26 and ZnO-coated AgNW networks using DEZ as the Zn source.25
Fig. 3 Comparison of growth per cycle (GPC) (a) values and growth rates (b) for various ALD (open symbols) and SALD (closed symbols) processes using Zn(DMP)2 (solid lines) or DEZ (dashed lines) at different deposition temperatures in literature.10,17,27,28 The thickness of samples deposited using Zn(DMP)2 open-air SALD is also tracked against the number of ALD cycles deposited (c) to extract precise GPC values and to prove high thickness control of the deposition approach. The evolution of the GPC with the platen speed (d), revealed a saturation trend at slower speeds which confirms the ALD behaviour of our process (the x axis was inverted to use a metric proportional to the Zn(DMP)2 pulse time). |
Zn(DMP)2 open-air SALD has been used to produce ZnO thin films with H2O as co-reactant. At first, the GPC was found to increase with the temperature until 140 °C, after which a relative plateau was reached, which seems to correspond to the beginning of the ALD window for this process. In the 140–180 °C range the GPC value is steady between 0.7 and 0.8 Å, with a more precise investigation of the GPC shown in Fig. 3c yielding a GPC of 0.77 Å at 180 °C. Temperatures above 260 °C could not be probed using the present open-air SALD setup, although a certain amount of precursor decomposition above 180 °C could be expected, as observed in the PEALD data from Mai et al.10 Though this phenomenon is not observed at 180 °C in our setup using H2O as a co-reactant, we may still expect a similar temperature dependent GPC increase for longer precursor exposures, as possibly indicated by the mild increase still visible between 180 and 260 °C.
The Zn(DMP)2 exposure time necessary to reach surface saturation was found to decrease as the temperature increased from 140 °C to 180 °C (cf. ESI,† Fig. S5) which is indicative of a chemisorption-based adsorption process within this temperature window.27 As such, this could explain why a small GPC increase is visible in this window as the exposure time was kept constant while the growth kinetics were sped up, while lower temperatures would in fact need longer exposure times to reach the same degree of saturation.
When increasing from 180 °C to 260 °C, however, the saturation time was found to increase, indicating instead a physisorption process, which does not lead to the self-limiting growth necessary for ALD. Therefore, while an ALD window can be traced from 140 °C to at least 180 °C, this window does not extend up to 260 °C using the present setup.
When the growth rate of Zn(DMP)2 is compared to that of DEZ, processes using the former precursor tend to yield a lower throughput (cf.Fig. 3b) due to the longer pulse times required to saturate the same surface (due to lower precursor volatility and reactivity) and due to the lower GPC value of Zn(DMP)2 overall with respect to DEZ. Despite this limitation, open-air SALD using Zn(DMP)2 could still yield a growth rate roughly twice as fast as ALD using DEZ at the same deposition temperature of 180 °C. As discussed in the introduction, this is because switching from ALD to SALD significantly increases the deposition throughput notably by avoiding the long purge times needed in the ALD cycle. Elsewhere, Zn(DMP)2 SALD is understandably slower than DEZ SALD though it reached growth rates between 1 and 2 orders of magnitude higher than temporal ALD approaches.
It should be noted that the growth rate in SALD is calculated by using an optimal SALD cycle time defined by the spatial period of an ALD cycle on the SALD manifold divided by the substrate speed. This approach gives a real cycle time value but (for the sake of comparison between SALD and ALD processes) neglects that in some architectures, such as the one described here and in the DEZ SALD instance from Ellinger et al.,28 parts of the substrate may be outside the deposition region leading to a lower effective growth rate. Data on conventional ALD with Zn(DMP)2 is reported from Stefanovic et al.12 who used a purge time of 20 s in between three short precursor pulses (double Zn(DMP)2 pulse + H2O pulse) leading to around 60 s of cycle time.
Samples prepared at a substrate temperature of 140–220 °C were found to exhibit almost no ZnO (002) peak as expected at a diffraction angle of 2θ = 34.4° (ICDD reference no. 00-036-1451). This corresponds to a suppression of the crystal growth along the c-axis of the hexagonal ZnO lattice and/or a low probability for crystallites to be oriented with a vertical c-axis (i.e. perpendicular to the substrate surface). Preferential growth along the c-axis was only achieved after heating the substrate to 260 °C, at which point a highly textured thin film was obtained along the 〈001〉 direction, whose properties are particularly useful for piezoelectric applications.29 The suppression of c-axis growth at lower ALD temperatures is in fact often observed in ALD experiments using DEZ as a precursor, where textured growth along the 〈001〉 direction typically only begins from 200 °C approximately.9,17,30,31
The ZnO surface morphology evolved to reflect this change in texture (cf.Fig. 4d). This temperature was however much higher than the precursor decomposition onset temperature of 180 °C suggested by Mai et al.,10 which may also explain a parasitic deposition of non-volatile precursor fragment aggregates in our experiments at 260 °C as reported in Fig. S6,† though such a decomposition could not be observed in our experiments at 180 °C.
The density of films deposited in the 140–260 °C range was consistently around 5.1 g cm−3 as shown in Fig. S3 and S4a.† This value is lower than those typically obtained through ALD32 and open-air SALD33 using DEZ which is reported in the range of 5.41 to 5.61 g cm−3. This discrepancy may be explained from the potentially lower grain size in the films derived from Zn(DMP)2, leading to a higher preponderance of grain boundaries in the mass of the thin film due to lower GPC values as evidenced in experiments using DEZ.33 This may in turn lead to poorer conductive properties for the Zn(DMP)2-derived ZnO.
Chemical analysis of a sample deposited using a Zn(DMP)2/H2O process at 150 °C was performed using XPS and the peaks obtained could be fitted using mixed Gaussian/Lorentzian contributions (Fig. 5) which were associated to atomic orbitals in different chemical environments, except for the N 1s orbital, which was below the detection limit around 0.3% (atomic). The area of these contributions could be linked to a direct atomic percentage of each atom, differentiated in terms of chemical environment when applicable, as given in Table S2.†
Fig. 5 XPS spectra of ZnO sample using Zn(DMP)2 deposited at 150 °C: the carbon 1s orbital (a), the nitrogen 1s orbital (b), the O 1s orbital (c), and the 3/2 peak of the Zn 2p orbital (d) are shown. |
This revealed a relatively low carbon contamination in the film (less than 2.5% at) in C–C and C–H bonds for the most part while a slightly lesser CO contribution was also found. This C contamination may be due to leftover organic surface contaminants after the sputter cleaning or potentially from precursor fragments, although no precursor-derived N could be detected.
The O 1s orbital could be deconvoluted into two main contributions, one around 530.5 eV from the oxygen in the wurtzite crystal lattice of ZnO and another around 532.1 eV, which may be linked to OH and O− species from absorbed hydroxides and O2 in the film or metal carbonates, but could also be the consequence of atmospheric processing, resulting in adsorbed oxygen on grain boundaries as suggested in previous experiments using open-air SALD.34 By fitting the Zn 2p3/2 orbital, we could determine the stoichiometry of ZnO at O/Zn = 1.03 within the wurtzite lattice and O/Zn = 1.31 taking all O contributions into account. A similarly O-rich film was obtained at this temperature by Stefanovic et al. through both temporal and spatial ALD approaches which they attributed to absorbed hydroxides and oxygen vacancies.12
The same approach has been used in this work to assess the quality of the deposited ZnO thin films, which was deposited using a modified Zn(DMP)2 open-air SALD process at 150 °C described in the ESI† report linked to this paper and which yielded a GPC of 0.40 Å.
It is worth noticing that the temperature used by Khan et al.25 (200 °C) was significantly higher than the one used here (150 °C); this is a clear asset to consider low temperature deposition since it enables to consider sensitive substrates (such as polymeric substrate or organic compounds). These nanocomposites may indeed be incorporated in flexible transparent conductive devices which could be used in new-generation photovoltaic cells, touch-screen displays, OLEDs, smart-windows, and transparent heaters.35,36
The TEM and back-scattered SEM images revealed a ZnO thickness that increased with more ALD cycles at a rate consistent with that observed from thin films. The SAED patterns presented point-wise diffraction peaks corresponding to a monocrystalline phase as well as a series of concentric rings corresponding to a second polycrystalline phase which could be attributed to the signal from the AgNW and the ZnO coating respectively (the detail of image D1 and the relevant analysis are given in Fig. S11† for one sample). The coatings were conformal as evidenced by the consistent coating thicknesses around all nanowires but had a higher roughness for thicker coatings as seen in images C2 and C3 in particular. This may be due to the suppressed growth along the c-axis discussed before, which results in the growth of flake-like hexagonal grains that extend horizontally and thus cause higher roughness around substrates with high curvatures (such as nanowires) than on planar substrates.
Using the BS SEM from Fig. 6 (images B1–B3), we could extract a rough estimate of the ZnO coating thickness with respect to the number of cycles (cf. Fig. S12†), the slope of which corresponded to the GPC observed for ZnO thin films grown on glass.
This morphology change occurs in an effort to reduce the Ag surface area as described by the Plateau–Rayleigh instability.26 Coating this surface with a material such as ZnO introduces a diffusion barrier delaying this morphology change. As such, the diffusion coefficient of Ag through ZnO is an important parameter for the stability enhancement of these networks. This also implies that the protective metal oxide coating must be conformal to avoid higher Ag diffusion through less thickly coated parts. Here, “failure” of the nanocomposites refers here to the point after which the measured sheet resistance dramatically and irreversibly increases exclusively as a consequence of the loss of the percolation phenomenon across the sample.
The dependence between the AgNW network electrical resistance versus voltage during a voltage ramp of = 0.1 V min−1 is plotted in Fig. S12.† An increase of the resistance with the voltage is observed due to the Joule effect increasing the temperature in the AgNWs. For larger voltages, electrical failure of the nanocomposite networks is observed for a given voltage, named failure voltage. Fig. 7 exhibits the failure voltage versus the ZnO coating thickness (LZnO). As with experiments using ZnO derived from DEZ,25 thicker Zn(DMP)2-derived ZnO coatings around the AgNW did indeed delay the spheroidization of the nanowires and thus delayed the electrical failure of the sample, from 9 V in the non-coated case to 17.2 V for a ZnO coating thickness around 35 nm.
Fig. 7 Evolution of failure voltage vs. ZnO coating thickness around AgNWs, with the green region corresponds to a percolating network and the red region to non-percolating networks (i.e. after failure), and fitting our data with eqn (1). |
Other ramp values will change this trend as the diffusion process is time-dependent. According to Khan et al.,25 a parabolic dependence law (eqn (1)) can be used to fit the experimental points by using the value of bare AgNW networks (Vfailbare AgNW = 9 V) in their case, which given the similarity of the experimental conditions can also be considered to be the case here. The dependence of the failure voltage Vfailcoated AgNW of the nanowire network coated with a ZnO coating of thickness LZnO can be expressed as
(1) |
This nonetheless shows the failure voltage was nearly doubled by coating the AgNW network with a 35 nm coating of ZnO made using Zn(DMP)2 as a non-pyrophoric precursor in atmospheric pressure SALD.
The LCA of the synthesis step tracked the impact of producing a kilogram of DEZ versus a kilogram of Zn(DMP)2. The synthesis approach for DEZ is taken as per the standard Zn–Cu couple approach, whereas the synthesis approach for Zn(DMP)2 was based on salt metathesis reaction described in the experimental section.40 A second LCA was performed by studying the impact of the open-air SALD process using either precursor to produce sample with identical thicknesses. The comparative LCA results are presented in Fig. 8 and the detailed parameters used for the study are given Fig. S8 through Fig. S10.†
Fig. 8 Comparative LCA of DEZ vs. Zn(DMP)2 in terms of Zn precursor synthesis and ZnO open-air SALD. The most strongly affected categories are written in bold in the legend. |
Despite the LCA result showing a similar order of magnitude between the total single scores for the synthesis of DEZ and Zn(DMP)2, the crucial takeaway should be that both routes have very different footprints. In the case of DEZ, the synthesis single score is higher in the “resource use, minerals, and minerals” category than all other contributions combined. This is due to the use copper in the synthesis to activate the zinc and increase the yields,41 which is currently classified as a “near critical” material for the coming 2025–2050 period by the U.S. Department of Energy due to the heavy exploitation of current copper resources worldwide and its crucial role in electrification.42
For Zn(DMP)2, however, the resource use contribution is far lower as the synthesis only requires using ZnCl2 which can be derived using metallic zinc, which itself can be recycled from iron and steel processing.43 For most other categories, however, we find the current Zn(DMP)2 synthesis approach produces a worse environmental impact than DEZ. Part of this may be attributed to use of tetrahydrofuran (THF), a solvent which is typically produced from hydrocarbons out of the petrochemical industry, as is generally the case for ethers.44 Separately, we may also expect the longer and more complex synthesis of Zn(DMP)2 to have a considerable impact on the overall energy consumption of the synthesis, which has its own environmental footprint. To alleviate the impact of the solvent on Zn(DMP)2 synthesis, other routes would need to be explored such as using THF produced from renewable sources45 or another solvent such as 2-methyltetrahydrofuran which can be derived from biomass and has been suggested as an alternative to THF and Et2O for Grignard reactions.46,47
Alternatively mechanochemistry may be used, which has already made great advancements in producing Grignard reagents for organic synthesis, minimizing the amount of ether solvents required to additive levels.48,49 If a feasible transfer to metal chlorides as electrophiles could be realized, great improvements for product synthesis are achievable. Alternatively, mechanochemically performed alkali salt metathesis reactions have been proven to work opening another possible pathway for Zn(DMP)2 synthesis.50
In contrast, the LCA for the open-air SALD process showed a very similar footprint for both precursors, with a relative improvement in the DEZ process across the board compared with the Zn(DMP)2. This difference is mostly due to the faster growth rate which leads to a faster deposition and thus a lesser energy consumption linked with the various heating and electrical components as well as the nitrogen carrier gas consumption. As such, aiming for higher growth rates should be the main method to improve the deposition process environmental impact.
The environmental impact of the SALD process was shown to be larger for Zn(DMP)2 insofar as the deposition lasted longer, resulting in a larger electricity consumption, while the greater impact of Zn(DMP)2 synthesis step versus DEZ may be reduced by replacing THF with “greener” alternative solvents.
The conformality and functionality of the ZnO coatings could be verified in the context of protective coatings as Ag diffusion rate-controlling barriers to enhance the stability of ZnO/AgNW nanocomposite networks. These polycrystalline coatings were shown to be similar to their DEZ counterparts, though the anisotropic growth of ZnO produced using Zn(DMP)2 combined with the high curvature present at the AgNW surface is suspected to have caused a higher ZnO coating roughness resulting in an easier Ag diffusion through less well protected regions, which could also have been caused by the slightly lower ZnO density observed.
Overall, Zn(DMP)2 has shown to be a convenient alternative to DEZ, not despite—but thanks to its lower reactivity and volatility at room temperature, allowing it to be non-pyrophoric and therefore safer in transport and in open-air setups while maintaining thin film quality and functionality, while the high growth rate of DEZ was matched and even exceeded by Zn(DMP)2 by opting for a high-throughput ALD approach such as SALD. These properties of Zn(DMP)2 make it very versatile and easy to use especially in research environments, where flexibility is needed and changing experimental setups are common.
Footnote |
† Electronic supplementary information (ESI) available. See DOI: https://doi.org/10.1039/d4lf00160e |
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