Issue 2, 2025
From the journal:

Chemical Communications

A fully polydicyclopentadiene skeletonized epoxy resin system and its fundamental properties as an electronic material†

Yuqing Li,ab   Peng Zhao,a   Xiongtao Ju,a   Shutong Jiang,a   Long Zhang, ORCID logo ab   Jianhua Li,b   Shun Li, ORCID logo ac   Xu Li ORCID logo *de  and  Jianming Zhang ORCID logo *abc  

* Corresponding authors

a School of Chemistry and Chemical Engineering, Jiangsu University, 301 Xuefu Rd, Zhenjiang, China
E-mail: zhangjm@ujs.edu.cn

b Jiangsu YuanJingHong Technology Co. Ltd, Zhenjiang, China

c Foshan (Southern China) Institute for New Materials, Foshan, China

d Institute of Materials Research and Engineering (IMRE), Agency for Science Technology and Research (A*STAR), Singapore 138634, Singapore

e Institute of Sustainability for Chemicals, Energy and Environment (ISCE2), Agency for Science Technology and Research (A*STAR), Singapore

Abstract

A low-cost fully dicyclopentadiene (DCPD)-networked epoxy system was designed. Compared to commercial diglycidyl ether of bisphenol-A epoxy resin counterparts, the cured DCPD-based resin demonstrates excellent thermal properties (Tg > 250 °C) and a low dissipation factor (0.0065 at 10 GHz), indicating its potential as a promising thermoset for high-performance electronic applications.

Graphical abstract: A fully polydicyclopentadiene skeletonized epoxy resin system and its fundamental properties as an electronic material

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Article information

DOI
https://doi.org/10.1039/D4CC05871B
Article type
Communication
Submitted
02 Nov 2024
Accepted
26 Nov 2024
First published
26 Nov 2024

Chem. Commun., 2025,61, 350-353

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A fully polydicyclopentadiene skeletonized epoxy resin system and its fundamental properties as an electronic material

Y. Li, P. Zhao, X. Ju, S. Jiang, L. Zhang, J. Li, S. Li, X. Li and J. Zhang, Chem. Commun., 2025, 61, 350 DOI: 10.1039/D4CC05871B

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