Nanoscale interface of metals for withstanding momentary shocks of compression

Abstract

The failure of the nanoscale metallic interface has raised concerns owing to the effect interfacial amalgamation has on its application in nanoelectronic devices. Single crystal copper [110] and [100], which are set as two components of [110]‖[100] nanocrystalline copper, are used to simulate the interfacial properties using molecular dynamics simulations. Repeated tension and compression cycles show that the two components of the interface can come into contact and separate without interfacial amalgamation. The [110]‖[100] interface could withstand momentary shocks of compression and heat produced by the momentary shocks. This property of the [110]‖[100] interface is dominated by crystalline orientations of interfacial structure, in comparison with [111]‖[100] and [111]‖[110] interfaces under the same conditions.