Wenjing
Sun
*ab,
Islam
Hafez
bc,
Barbara J. W.
Cole
d and
Mehdi
Tajvidi
b
aInstitute of Materials (IMX), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne 1015, Switzerland. E-mail: wenjing.sun@epfl.ch
bLaboratory of Renewable Nanomaterials, School of Forest Resources, University of Maine, Nutting Hall, Orono, Maine 04469-5755, USA
cDepartment of Wood Science and Engineering, Oregon State University, Corvallis, Oregon 97331, USA
dDepartment of Chemistry, University of Maine, Orono, Maine 04469-5755, USA
First published on 15th May 2024
This study investigated the adhesion at the interface between mycelium and wood in detail, focusing on the evaluation of different bonding systems and the influence of hot-pressing temperature on bonding strength. The behavior of water-soluble components and their significance in this context were examined through chemical extraction experiments and analysis. The results indicated that both degraded wood veneer and surface mycelium exhibit comparable bonding strength. In addition, a significant finding of the study is that water-soluble components washed from mycelium, which exhibit a 7% higher protein content and a distinct carbohydrate composition compared to those washed from wood, are crucial in achieving effective bonding. Notably, proteins and high-molecular-weight carbohydrates are identified as key factors responsible for the favorable bonding behavior observed with mycelium. These findings offer valuable insights for the further development of sustainable materials utilizing mycelium as a binder and emphasize the importance of manipulating the composition of water-soluble components to optimize interfacial adhesion.
Fungal mycelium is a unique candidate for bio-based adhesives.7 The way it binds lignocellulosic biomass is distinctive. It grows and penetrates the substrate, acting not only as a binder but also as a fiber-like structure that reinforces the entire structure. Alongside the environmental benefits such as biodegradability, renewability, and a low carbon footprint, mycelium-bound products also demonstrate scalability potential. Several companies have already successfully scaled up the production of these products, such as construction panels, packaging, acoustic and thermal insulation foams, and more.8,9 However, the adhesion details at the interface and their influence on the properties of the composites are still unclear due to the complexity of both materials, which primarily include cellulose, hemicelluloses, lignin, extractives in lignocellulosic biomass, and chitin, glucan, and proteins in hyphae.7,10,11
Previous research has demonstrated the significance of the mycelium–wood interface in bonding wood veneer.10 This interface marks the bottom surface of the mycelium and the top surface of the wood veneer. The adhesion potential of the mycelium layer's bottom surface can support a single mycelium layer to bond untreated wood, while the modified wood surface can also provide impressive bonding to the wood veneers themselves without any mycelium.10 Moreover, the bonding strength of mycelium-bonded wood was comparable to that of commercial wood glue, with the mycelium adhesive demonstrating better resilience to water exposure.10 The adhesion at the interface is thought to be associated with enzymes secreted by fungi, degraded wood components such as monosaccharides, and depolymerized lignin, through mechanisms including diffusion, hydrogen bonding, and potential covalent bonding after heat treatment. However, these theories are yet to be fully confirmed, and several remaining questions exist. For instance, how much of the “adhesion components” attach to the mycelium bottom surface and how much remains on the veneer surface when separating surface mycelium from wood veneer surface, and how do they contribute to the bonding of stand-alone mycelium and stand-alone wood? What are the adhesion mechanisms involved in different systems, and what is the extent of their contributions? How does the change in the pressing temperature influence bonding performance, and how stable is adhesion in wet conditions?
To address these questions, we aimed to further investigate the mycelium–wood interface. In this work, we started by testing three bonding systems: “degraded veneer without surface mycelium”, “degraded veneer with surface mycelium”, and “untreated veneer with surface mycelium”. We evaluated the effect of hot-pressing temperature on both dry and wet lap-shear strength of the wood veneer samples. We also examined the importance of water-soluble components in these systems by washing the separated veneer and mycelium with water separately and evaluating changes in their adhesion behavior. Finally, we identified the chemicals that had been washed off from veneer and mycelium and the changes on the surfaces, providing us with a better understanding of the adhesion details at the interface of fungal mycelium and lignocellulosic biomass.
Fig. 1B and D show the wet lap-shear strength of different groups after being soaked in water for 48 h. Water-resistance properties are essential for exterior applications and can provide useful information on the adhesion mechanism. As expected, all the groups lost more than 70% of their lap-shear bonding strength. For 120 °C pressed D and WD groups, all the samples were delaminated after soaking in water for 48 h; therefore, no data could be obtained. There was no significant difference (p > 0.05) in the strength value between 180 °C and 220 °C pressed WD groups and they were all lower than 0.5 MPa (Fig. 1B). The wet lap-shear strength of the DM and UM groups behaved similarly; only the DM group that was pressed at 220 °C showed a value slightly higher than the other groups (0.54 MPa) but not significantly different (p > 0.05) (Fig. 1D).
From a practical point of view, it seems that there is no need to apply a higher temperature for better bonding. As for all three systems, only increasing the hot-pressing temperature from 120 °C to 220 °C was able to achieve some but still very little improvement in the lap-shear strength. And the wet strength for all the temperatures was very low, which will limit the applications for the products that purely rely on these bonding systems. These observations are different from some previous research, where higher temperatures generally showed higher MOR values for composite products.11 However, none of the studies compared the temperature in the same experimental set-up; the trend might just be caused by other experimental factors such as the composite type, the pressure and time used, or substrate species.
As for the adhesion mechanism examination, the weak wet strength indicates that there are not enough covalent bonds in the adhesion system. The bonding may come from water-sensitive hydrogen bonds and van der Waals interactions.12 Increasing the pressing temperature may degrade more surface components to small molecules and accelerate their softening and flow to improve the diffusion and mechanical interlocking,13 but this was not very efficient in our experimental set-up.
The chemical changes of the veneer surfaces as a result of fungal degradation are shown in Fig. 2. The fingerprint areas of the FTIR spectra (Fig. 2A) show no major changes after degradation and washing, indicating that the chemical components remained similar on the surface or that any small differences could not be detected using FTIR. With the increase of hot-pressing temperature, the two peaks at 1594 cm−1 and 1640 cm−1, representing the aromatic rings of lignin, became closer and merged at 220 °C. This may be attributed to the increase in relative lignin content attributable to the degradation of hemicellulose.14 In contrast, the peaks between 1460 and 1470 cm−1, attributed to aliphatic CH bending of lignin, were separated into two peaks after heat treatment. This separation may indicate lignin undergoing changes, potentially due to either condensation or the formation of CH2 bridges between lignin fragments.14 The peak at 1250 cm−1 was relatively increased in intensity and separated into two peaks, indicating new linkages on the asymmetric C–O–C stretching band for lignin.15 The appearance of the peak at 781 cm−1 also could be attributed to changes in lignin or reveals the production of new unknown compounds after high-temperature treatment.16
Fig. 2 Chemical changes of wood veneers after degradation, washing and hot-pressing. (A) FTIR; (B) O/C ratio; (C) N/C ratio; (D) carbon I, II, III ratios. |
XPS was also applied on the veneer surfaces after different treatments (Fig. 2B–D) to study the surface chemistry changes. As shown in Fig. 3B and C, the relative O/C and N/C ratios were increased after degradation and decreased after hot-pressing. The increase after degradation indicates the oxidation of the veneer surface and the secreted proteins from fungi.17 The decrease in O/C ratio with the heating process (Fig. 2B) could be attributed to hemicellulose degradation and lignin rearrangement during the heat treatment as the O/C ratio of hemicellulose is much higher than that of lignin.18Fig. 2D shows the percentage of different carbon types. Carbon I corresponds to carbon atoms bonded only to carbon or hydrogen atoms (C–H, or C–C); carbon II corresponds to carbon atoms bonded to one single non-carbonyl oxygen atom (C–O); and carbon III peak corresponds to carbon atoms bonded to a carbonyl or two non-carbonyl oxygen atoms (CO or O–C–O).18,19 The degradation of wood veneer caused the decrease of carbon I and the increase of carbon III (Fig. 2D), confirming the oxidation caused by fungal degradation. Carbon I further decreased after heat treatment, which may be attributed to the reactions of fragmentation and oxidation because of the high temperature. The increase of carbon II at 220 °C may be due to the degradation of amorphous polysaccharides and the general increase of carbon II is due to the formation of carbonyl structures.20
Fig. 3 Performance and characterization of freeze-dried supernatants from veneer (SV) and mycelium (SM): (A) dry lap-shear strength; (B) protein content; (C) FTIR; (D) monosaccharide compositions. |
FTIR and XPS spectra differences between different groups suggested that chemical transformations occurred on the veneer surface leading to the formation of new chemical bonds after the degradation by hot-pressing, which may contribute to the bonding.
Fig. 3A shows the dry lap-shear strength of autoclaved wood veneers bonded with SV and supernatants washed from mycelium SM and hot-pressed at 120 °C. Notably, SV-bonded untreated veneers showed similar strength to bonded unwashed (D) and washed degraded (WD) veneers (Fig. 1A). Differently, SM showed a much higher lap-shear bonding strength (Fig. 3A), 2.22 MPa. It is significantly higher than the values of all groups pressed at 120 °C (Fig. 1A and C) and confirms the importance of water-soluble components in the bonding system of the surface mycelium layer.
The chemical compositions of SV and SM were characterized to further understand the difference in their origin, structure, and adhesion behavior. The FTIR spectra of SV revealed typical peaks at 1730, 1604, 1509, 1381, and 1250 cm−1, indicating that SV compositions include hemicellulose and lignin fractions (Fig. 3C).21,22 The FTIR spectrum (Fig. 3C) of SM shows similar peaks to SV with some differences. The missing peak at 1730 cm−1, which corresponds to the carbonyl group, indicates that the degraded xylan fractions mostly remained in the wood veneers. The peak at around 1620 cm−1 (amide I: CO, C–N) is broader and there are two more peaks appearing at 1545 cm−1 (amide II: C–N, C–H) and 1317 cm−1 (amide III: CO–NH) compared with the veneer supernatant, which indicates that more protein exists in the mycelium supernatant.
The protein concentration analysis indicates a 7% higher protein content in SM compared to SV (Fig. 3C). 13C NMR spectra also support this finding, revealing substantial amounts of proteins in both samples, as evidenced by the presence of 13C chemical shifts in the carbonyl, aromatic, and aliphatic regions (Fig. S3†). Moreover, the ratio between carbonyl C and sugar anomeric C is significantly higher in SM than SV.
Glycosyl analysis demonstrates a significant difference in xylose content, with SV containing 29% xylose (Xyl) compared to only 7% in SM (Fig. 3D). The elevated level of xylose in SV may be due to the intensive degradation of the main polymer chain and the inherent solubility of birch xylan, which is characteristically acetylated and contains glucuronic acid side chains. Additionally, dominant monosaccharides identified in SV included glucose (Glc) at 19%, galactose (Gal) at 18%, and galacturonic acid (GalA) at 15%, all are common components of birch hemicellulose,23 confirming the degradation of hemicellulose. The presence of high levels of Glc suggests the degradation of cellulose. Previous studies have shown that monosaccharide composition varies during degradation, with side-chain elements being more susceptible to degradation compared to the main polymer chain.23,24 Therefore the degradation might be intensive at this particular stage. Differently, major monosaccharides identified in SM are Gal at 26%, Glc at 22%, and mannose at 14%. Water-soluble components from fungal mycelium are believed to mainly consist of extracellular polysaccharides (EPS), typically extracted from the supernatant of liquid fermentation.25,26 In solid-state fermentation, such as in our case, the EPS accumulates and forms a matrix around the hyphae at the interface between the substrate and the mycelium (so-called biofilm hyphae in some contexts).10,27 The dominant monosaccharides detected in SM align with the reported EPS composition of Basidiomycetes from liquid fermentation, which varies with species, growing conditions, and additives, but most of them contain glucose, mannose, and galactose, which are the dominant monosaccharides in the SM sample.25 The SEC chromatograms (Fig. S3†) reveal that the major components in both SV and SM have an average molecular weight of 1 kDa. However, SM contains additional minor components in the range of 1050 kDa, 100 kDa, 60 kDa, and 20 kDa, absent in SV, supporting the presence of EPS in SM. Further analysis shows that SM includes a higher proportion of higher-molecular-weight components compared to SV (Fig. S3B†), which may relate to the fact that their adhesion ability is higher.
Referring back to Fig. 3C, the FTIR curve of SV shows no significant changes after heat treatment, while SM exhibits some changes. SM displays a broad peak at the region around 1620 cm−1, which corresponds to amide II of the proteins. After heat treatment, it shifts to the wavelength of 1610 cm−1 as a sharp peak, which along with the increased intensity of the amide III peak at 1317 cm−1, may indicate protein denaturation and conformation change due to heat treatment.28 There is also some evidence of Maillard-related reactions between proteins and reducing sugars after heat treatment of the mycelium supernatant. The peak at 1660 cm−1 has been assigned to the CN stretching vibration, indicating Schiff's base products.29 The appearance of an additional frequency shoulder at 1715 cm−1, corresponding to a carbonyl (CO) group, may originate from the Amadori products (glycated residues).28 The features between 1360 and 1460 cm−1 are broader after heat treatment, probably corresponding to the C–NC bonds of imines.28,30 Similarly, in the 13C NMR spectrum, after heat treatment, only subtle changes occurred in SV, whereas the protein signal region of SM became broader, suggesting conformational changes in the protein structure (Fig. S2†).
It is important to note that the components that had been washed off (SV and SM) were not solely located at the interface between the top surface of the wood veneer and the bottom surface of the mycelium layer. Since the entire veneer and mycelium sheet were washed in water, water-soluble components were extracted from all thickness levels. Therefore, SV should include components from penetrative mycelial hyphae inside wood; and some degraded wood components may also be attached to the mycelium sheet and may have been included in the analysis of SM. Additionally, after freeze-drying, both SV and SM contained insoluble fractions, which may introduce variations in analysis. However, our previous studies have demonstrated that the bottom surface of the mycelium layer exhibits significantly higher bonding strength compared to the top surface;10 and the lap-shear strength results of this work clearly indicated the importance of SM in bonding. Thus, we believe our investigation is heading in the right direction and holds considerable significance. The findings of this study reveal that water-soluble components, comprising approximately 22% proteins, with a substantial proportion of small molecular weight carbohydrates and a small fraction of large molecular weight carbohydrates, contribute significantly to fungal-assisted wood bonding. In the bonding systems that rely on the interface, such as plywood and laminated veneers, it will be beneficial to explore approaches to enhance these materials through increasing the water-soluble components, such as changing the growing environment, selecting suitable species or engaging in gene modification. For more complex systems such as mycelium-bonded composites, additional factors such as the structure and quality of the mycelial hyphae themselves also need to be taken into consideration when optimizing the interfacial adhesion.
In the kinetic exploration of adhesion mechanisms, as outlined in Fig. 4, we observed that wood–wood bonding does not primarily rely on the mechanical interlocking of wood cells. Instead, it suggests a more complex interaction, likely involving chemical transformations due to degradation and heat, such as the diffusion of softened lignin and covalent bonding through lignin condensation. Conversely, wood–mycelium bonding is markedly influenced by water-soluble components containing carbohydrates and proteins, which diffuse into the porous structure and may form covalent bonds via the Maillard reaction. Both bonding types seem to reach their optimal effectiveness at a pressing temperature of 120 °C, with limited additional improvement at higher temperatures. However, the diminished wet strength in both systems suggests that the predominant bonding mechanisms are hydrogen bonds and van der Waals interactions, resulting from the redistribution of surface components.
Fig. 4 Schematic figure showing adhesion mechanisms involved in wood–wood bonding and wood–mycelium bonding in view of current adhesion theories. |
Footnote |
† Electronic supplementary information (ESI) available. See DOI: https://doi.org/10.1039/d4lf00061g |
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